Granted Patent
Utility
US 6,716,735 · App. 10/327,858
Method for forming metal lines of semiconductor device
Inventors:
Jae-Suk Lee, Young Sung Lee
Patented Case
View Patent ↗
Granted: Apr 6, 2004
Filed: Dec 26, 2002
Inventors
Jae-Suk Lee
Young Sung Lee
Assignee (at issue)
Dongbu Electronics, Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.