IP Library › Granted Patent US 6,716,737
Granted Patent Utility
US 6,716,737 · App. 10/208,363

Method of forming a through-substrate interconnect

Inventors: Hubert Vander Plas, Barry C. Snyder, Ronald A. Hellekson, Ronnie Yenchik, Diane Lai, Samson Berhane
Patented Case View Patent ↗
Granted: Apr 6, 2004 Filed: Jul 29, 2002
Inventors
Hubert Vander Plas
Barry C. Snyder
Ronald A. Hellekson
Ronnie Yenchik
Diane Lai
Samson Berhane
Assignee (at issue)
Hewlett-Packard Development Company, L.P.

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

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Quick Facts
Patent No.
US 6,716,737
App. No.
10/208,363
Filed
2002-07-29
Granted
2004-04-06
Kind
B2