Granted Patent
Utility
US 6,716,748 · App. 10/047,814
Reaction chamber for processing a substrate wafer, and method for processing a substrate using the chamber
Inventor:
Alfred Kersch
Patented Case
View Patent ↗
Granted: Apr 6, 2004
Filed: Jan 15, 2002
Inventor
Alfred Kersch
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.