Granted Patent
Utility
US 6,717,246 · App. 10/123,930
Semiconductor package with integrated conical vapor chamber
Inventor:
Gerald A. Budelman
Patented Case
View Patent ↗
Granted: Apr 6, 2004
Filed: Apr 16, 2002
Inventor
Gerald A. Budelman
Assignee (at issue)
Intel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.