Granted Patent
Utility
US 6,718,629 · App. 09/558,779
Method and apparatus for mounting components onto a substrate of an electrical assembly
Inventor:
Harald Stanzl
Patented Case
View Patent ↗
Granted: Apr 13, 2004
Filed: Apr 26, 2000
Inventor
Harald Stanzl
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.