Granted Patent
Utility
US 6,720,207 · App. 09/971,731
Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
Inventors:
Masanori Minamio, Fumihiko Kawai, Masahiko Ohiro, Masanori Koichi, Yoshinori Satoh, Akira Oga, Toshiyuki Fukuda
Patented Case
View Patent ↗
Granted: Apr 13, 2004
Filed: Oct 9, 2001
Inventors
Masanori Minamio
Fumihiko Kawai
Masahiko Ohiro
Masanori Koichi
Yoshinori Satoh
Akira Oga
Toshiyuki Fukuda
Assignee (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.