Granted Patent
Utility
US 6,720,262 · App. 09/738,213
Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst
Inventors:
Won-Yong Koh, Hyung Sang Park, Ji-Hwa Lee
Patented Case
View Patent ↗
Granted: Apr 13, 2004
Filed: Dec 15, 2000
Inventors
Won-Yong Koh
Hyung Sang Park
Ji-Hwa Lee
Assignee (at issue)
GENITECH, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.