Granted Patent
Utility
US 6,720,274 · App. 10/291,474
Method for fabricating a semiconductor device and a substrate processing apparatus
Inventors:
Takashi Ozaki, Kenichi Suzaki, Norikazu Mizuno
Patented Case
View Patent ↗
Granted: Apr 13, 2004
Filed: Nov 12, 2002
Inventors
Takashi Ozaki
Kenichi Suzaki
Norikazu Mizuno
Assignee (at issue)
Hitachi Kokusai Electric Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.