Granted Patent
Utility
US 6,723,583 · App. 10/453,606
Method of manufacturing a semiconductor device using a mold
Inventors:
Noriyuki Takahashi, Masayuki Suzuki, Kouji Tsuchiya, Takao Matsuura, Takanori Hashizume, Masahiro Ichitani, Kazunari Suzuki, Takafumi Nishita, Kenichi Imura, Takashi Miwa
Patented Case
View Patent ↗
Granted: Apr 20, 2004
Filed: Jun 4, 2003
Inventors
Noriyuki Takahashi
Masayuki Suzuki
Kouji Tsuchiya
Takao Matsuura
Takanori Hashizume
Masahiro Ichitani
Kazunari Suzuki
Takafumi Nishita
Kenichi Imura
Takashi Miwa
Assignees (at issue)
Renesas Technology Corporation
Hitachi Ulsi Systems Co., Ltd.
Hitachi Yonezawa Electronics Co., Ltd
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.