IP Library Granted Patent US 6,723,643
Granted Patent Utility
US 6,723,643 · App. 10/391,435

Method for chemical mechanical polishing of thin films using end-point indicator structures

Inventors: Wei Pan, David R. Evans, Allen Burmaster
Patented Case View Patent ↗
Granted: Apr 20, 2004 Filed: Mar 17, 2003
Inventors
Wei Pan
David R. Evans
Allen Burmaster
Assignee (at issue)
Sharp Laboratories of America, Inc.

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Quick Facts
Patent No.
US 6,723,643
App. No.
10/391,435
Filed
2003-03-17
Granted
2004-04-20
Kind
B1