Granted Patent
Utility
US 6,723,664 · App. 10/041,609
Method and apparatus for depositing a thin film, and semiconductor device having a semiconductor-insulator junction
Inventors:
Hideki Matsumura, Akira Izumi, Atsushi Masuda, Yasunobu Nashimoto, Yosuke Miyoshi, Shuji Nomura, Kazuo Sakurai, Shouichi Aoshima
Patented Case
View Patent ↗
Granted: Apr 20, 2004
Filed: Jan 10, 2002
Inventors
Hideki Matsumura
Akira Izumi
Atsushi Masuda
Yasunobu Nashimoto
Yosuke Miyoshi
Shuji Nomura
Kazuo Sakurai
Shouichi Aoshima
Assignees (at issue)
Hideki Matsumura
NEC Compound Semiconductor Devices, Ltd.
Anelva Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.