Granted Patent
Utility
US 6,726,319 · App. 09/856,982
Method for inspecting surface of semiconductor wafer
Inventors:
Yoshio Yanase, Osamu Nakamura, Takashi Koike, Noboru Kudo
Patented Case
View Patent ↗
Granted: Apr 27, 2004
Filed: May 30, 2001
Inventors
Yoshio Yanase
Osamu Nakamura
Takashi Koike
Noboru Kudo
Assignee (at issue)
Sumitomo Mitsubishi Silicon Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.