Granted Patent
Utility
US 6,728,071 · App. 09/951,166
Head assembly having a head IC heat radiating element
Inventor:
Keishi Shimizu
Patented Case
View Patent ↗
Granted: Apr 27, 2004
Filed: Sep 13, 2001
Inventor
Keishi Shimizu
Assignee (at issue)
Fujitsu Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.