Granted Patent
Utility
US 6,729,022 · App. 10/230,329
Processes for manufacturing flexible wiring boards and the resulting flexible wiring boards
Inventors:
Hideyuki Kurita, Masanao Watanabe
Patented Case
View Patent ↗
Granted: May 4, 2004
Filed: Aug 29, 2002
Inventors
Hideyuki Kurita
Masanao Watanabe
Assignee (at issue)
Sony Chemicals Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.