Granted Patent
Utility
US 6,730,532 · App. 10/086,050
Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process
Inventors:
Bo Soon Chang, Vani Verma
Patented Case
View Patent ↗
Granted: May 4, 2004
Filed: Feb 27, 2002
Inventors
Bo Soon Chang
Vani Verma
Assignee (at issue)
Cypress Semiconductor Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.