Granted Patent
Utility
US 6,730,995 · App. 10/357,586
Two-stage transfer molding device to encapsulate MMC module
Inventor:
Todd O. Bolken
Patented Case
View Patent ↗
Granted: May 4, 2004
Filed: Feb 3, 2003
Inventor
Todd O. Bolken
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.