Granted Patent
Utility
US 6,731,002 · App. 09/992,602
High frequency power device with a plastic molded package and direct bonded substrate
Inventor:
Kang Rim Choi
Patented Case
View Patent ↗
Granted: May 4, 2004
Filed: Nov 13, 2001
Inventor
Kang Rim Choi
Assignee (at issue)
IXYS, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.