Granted Patent
Utility
US 6,731,463 · App. 10/041,357
Wafer fabrication for thermal pole tip expansion/recession compensation
Inventors:
Jane Gates, Youping Mei, James R. Peterson, Lance E. Stover, Zine-Eddine Boutaghou, Wayne A. Bonin, Jason W. Riddering
Patented Case
View Patent ↗
Granted: May 4, 2004
Filed: Jan 8, 2002
Inventors
Jane Gates
Youping Mei
James R. Peterson
Lance E. Stover
Zine-Eddine Boutaghou
Wayne A. Bonin
Jason W. Riddering
Assignee (at issue)
Seagate Technology LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.