IP Library › Granted Patent US 6,732,304
Granted Patent Utility
US 6,732,304 · App. 09/666,208

Chip testing within a multi-chip semiconductor package

Inventor: Adrian E. Ong
Patented Case View Patent ↗
Granted: May 4, 2004 Filed: Sep 21, 2000
Inventor
Adrian E. Ong
Assignee (at issue)
Inapac Technology, Inc.

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Quick Facts
Patent No.
US 6,732,304
App. No.
09/666,208
Filed
2000-09-21
Granted
2004-05-04
Kind
B1