Granted Patent
Utility
US 6,734,044 · App. 10/166,458
Multiple leadframe laminated IC package
Inventors:
Chun Ho Fan, Tsui Yee Lin, Kin Pui Kwan, Shui Ming Tse, Wing Him Lau, Shuk Man Wong
Patented Case
View Patent ↗
Granted: May 11, 2004
Filed: Jun 10, 2002
Inventors
Chun Ho Fan
Tsui Yee Lin
Kin Pui Kwan
Shui Ming Tse
Wing Him Lau
Shuk Man Wong
Assignee (at issue)
A-SAT CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.