Granted Patent
Utility
US 6,734,552 · App. 09/902,878
Enhanced thermal dissipation integrated circuit package
Inventors:
Edward Combs, Robert Sheppard, Tai Wai Pun, Hau Wan Ng, Chun Ho Fan, Neil Robert McLellen
Patented Case
View Patent ↗
Granted: May 11, 2004
Filed: Jul 11, 2001
Inventors
Edward Combs
Robert Sheppard
Tai Wai Pun
Hau Wan Ng
Chun Ho Fan
Neil Robert McLellen
Assignee (at issue)
A-SAT CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.