Granted Patent
Utility
US 6,734,563 · App. 10/278,106
Post passivation interconnection schemes on top of the IC chips
Inventors:
Mou-Shiung Lin, Jin-Yuan Lee
Patented Case
View Patent ↗
Granted: May 11, 2004
Filed: Oct 22, 2002
Inventors
Mou-Shiung Lin
Jin-Yuan Lee
Assignee (at issue)
Megica Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.