Granted Patent
Utility
US 6,734,570 · App. 10/350,851
Solder bumped substrate for a fine pitch flip-chip integrated circuit package
Inventor:
John R. Archer
Patented Case
View Patent ↗
Granted: May 11, 2004
Filed: Jan 24, 2003
Inventor
John R. Archer
Assignee (at issue)
Gennum Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.