Granted Patent
Utility
US 6,737,748 · App. 10/082,554
Stacked via with specially designed landing pad for integrated semiconductor structures
Inventors:
Lothar Bauch, Thomas Zell, Matthias Lehr, Albrecht Kieslich
Patented Case
View Patent ↗
Granted: May 18, 2004
Filed: Feb 25, 2002
Inventors
Lothar Bauch
Thomas Zell
Matthias Lehr
Albrecht Kieslich
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.