Granted Patent
Utility
US 6,739,047 · App. 10/284,544
Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate
Inventors:
Mark S. Hammond, Ellen S. Tormey, Barry Jay Thaler, Leszek Hozer, Hung-Tse Chen, Bernard D. Geller, Gerard Frederickson
Patented Case
View Patent ↗
Granted: May 25, 2004
Filed: Oct 30, 2002
Inventors
Mark S. Hammond
Ellen S. Tormey
Barry Jay Thaler
Leszek Hozer
Hung-Tse Chen
Bernard D. Geller
Gerard Frederickson
Assignee (at issue)
Lamina Ceramics, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.