Granted Patent
Utility
US 6,740,539 · App. 10/366,149
Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates
Inventors:
Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Daniel C. Edelstein, Gill Yong Lee, Kia-Seng Low, Padraic Shafer, Alexander William Simpson, Peter Wrschka
Patented Case
View Patent ↗
Granted: May 25, 2004
Filed: Feb 13, 2003
Inventors
Richard A. Conti
Prakash Dev
David M. Dobuzinsky
Daniel C. Edelstein
Gill Yong Lee
Kia-Seng Low
Padraic Shafer
Alexander William Simpson
Peter Wrschka
Assignees (at issue)
International Business Machines Corporation
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.