Granted Patent
Utility
US 6,740,595 · App. 10/122,996
Etch process for recessing polysilicon in trench structures
Inventors:
Stephan Kudelka, Helmut Tews, Alexander Michaelis, Uwe Schroeder, Martin Popp, Kristin Schupke, Daniel Koehler
Patented Case
View Patent ↗
Granted: May 25, 2004
Filed: Apr 12, 2002
Inventors
Stephan Kudelka
Helmut Tews
Alexander Michaelis
Uwe Schroeder
Martin Popp
Kristin Schupke
Daniel Koehler
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.