Granted Patent
Utility
US 6,740,824 · App. 10/179,066
Ground connector assembly with substrate strain relief and method of making same
Inventors:
Lawrence R. Poglitsch, Ronald A. Li, Alan S. Kang, Todd Ringa, Steven G. Sharkey, Rick Cihak
Patented Case
View Patent ↗
Granted: May 25, 2004
Filed: Jun 25, 2002
Inventors
Lawrence R. Poglitsch
Ronald A. Li
Alan S. Kang
Todd Ringa
Steven G. Sharkey
Rick Cihak
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.