Granted Patent
Utility
US 6,740,960 · App. 10/231,752
Semiconductor package including flex circuit, interconnects and dense array external contacts
Inventors:
Warren M. Farnworth, Alan G. Wood, Mike Brooks
Patented Case
View Patent ↗
Granted: May 25, 2004
Filed: Aug 29, 2002
Inventors
Warren M. Farnworth
Alan G. Wood
Mike Brooks
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.