Granted Patent
Utility
US 6,740,985 · App. 09/716,350
Structure for bonding pad and method for its fabrication
Inventor:
Bin Zhao
Patented Case
View Patent ↗
Granted: May 25, 2004
Filed: Nov 20, 2000
Inventor
Bin Zhao
Assignee (at issue)
Newport Fab, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.