IP Library Granted Patent US 6,743,037
Granted Patent Utility
US 6,743,037 · App. 10/128,248

Surface mount socket contact providing uniform solder ball loading and method

Inventors: Kenneth Kassa, Vinayak Pandey
Patented Case View Patent ↗
Granted: Jun 1, 2004 Filed: Apr 24, 2002
Inventors
Kenneth Kassa
Vinayak Pandey
Assignee (at issue)
Intel Corporation

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Quick Facts
Patent No.
US 6,743,037
App. No.
10/128,248
Filed
2002-04-24
Granted
2004-06-01
Kind
B2