Granted Patent
Utility
US 6,743,310 · App. 10/079,517
Method of forming nitride capped Cu lines with improved adhesion and reduced electromigration along the Cu/nitride interface
Inventor:
Minh Van Ngo
Patented Case
View Patent ↗
Granted: Jun 1, 2004
Filed: Feb 22, 2002
Inventor
Minh Van Ngo
Assignee (at issue)
Advanced Micro Devices, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.