Granted Patent
Utility
US 6,743,319 · App. 10/265,513
Adhesiveless transfer lamination method and materials for producing electronic circuits
Inventor:
Paul H. Kydd
Patented Case
View Patent ↗
Granted: Jun 1, 2004
Filed: Oct 4, 2002
Inventor
Paul H. Kydd
Assignee (at issue)
Paralec Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.