Granted Patent
Utility
US 6,743,495 · App. 10/113,378
Thermal annealing process for producing silicon wafers with improved surface characteristics
Inventors:
Jiri L. Vasat, Andrei Stefanescu, Thomas A. Torack, Gregory M. Wilson
Patented Case
View Patent ↗
Granted: Jun 1, 2004
Filed: Mar 29, 2002
Inventors
Jiri L. Vasat
Andrei Stefanescu
Thomas A. Torack
Gregory M. Wilson
Assignee (at issue)
MEMC Electronic Materials, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.