IP Library Granted Patent US 6,743,642
Granted Patent Utility
US 6,743,642 · App. 10/289,488

Bilayer CMP process to improve surface roughness of magnetic stack in MRAM technology

Inventors: Gregory Costrini, John P. Hummel, Kia-Seng Low, Mahadevaiyer Krishnan
Patented Case View Patent ↗
Granted: Jun 1, 2004 Filed: Nov 6, 2002
Inventors
Gregory Costrini
John P. Hummel
Kia-Seng Low
Mahadevaiyer Krishnan
Assignees (at issue)
International Business Machines Corporation
Infineon Inc.

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Quick Facts
Patent No.
US 6,743,642
App. No.
10/289,488
Filed
2002-11-06
Granted
2004-06-01
Kind
B2