Granted Patent
Utility
US 6,743,979 · App. 10/652,453
Bonding pad isolation
Inventors:
Michael Berman, Aftab Ahmad, Qwai H. Low, Chok J. Chia, Ramaswamy Ranganathan
Patented Case
View Patent ↗
Granted: Jun 1, 2004
Filed: Aug 29, 2003
Inventors
Michael Berman
Aftab Ahmad
Qwai H. Low
Chok J. Chia
Ramaswamy Ranganathan
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.