Granted Patent
Utility
US 6,744,119 · App. 09/978,603
Leadframe having slots in a die pad
Inventors:
Frank Kuo, Sen Mao, Sam Kuo, Oscar Ou
Patented Case
View Patent ↗
Granted: Jun 1, 2004
Filed: Oct 15, 2001
Inventors
Frank Kuo
Sen Mao
Sam Kuo
Oscar Ou
Assignee (at issue)
Siliconix Taiwan LTD
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.