Granted Patent
Utility
US 6,744,124 · App. 09/468,249
Semiconductor die package including cup-shaped leadframe
Inventors:
Mike F. Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo, Wei-Bing Chu
Patented Case
View Patent ↗
Granted: Jun 1, 2004
Filed: Dec 10, 1999
Inventors
Mike F. Chang
King Owyang
Yueh-Se Ho
Y. Mohammed Kasem
Lixiong Luo
Wei-Bing Chu
Assignee (at issue)
SILICONIX INCORPORATED
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.