Granted Patent
Utility
US 6,744,336 · App. 10/271,392
Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same
Inventors:
Martin Goetz, Sarah Schwab
Patented Case
View Patent ↗
Granted: Jun 1, 2004
Filed: Oct 15, 2002
Inventors
Martin Goetz
Sarah Schwab
Assignee (at issue)
Clarisay, Incorporated
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.