Granted Patent
Utility
US 6,744,640 · App. 10/120,251
Board-level EMI shield with enhanced thermal dissipation
Inventors:
Bradley E. Reis, William Candy
Patented Case
View Patent ↗
Granted: Jun 1, 2004
Filed: Apr 10, 2002
Inventors
Bradley E. Reis
William Candy
Assignee (at issue)
Gore Enterprise Holdings, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.