IP Library Granted Patent US 6,746,539
Granted Patent Utility
US 6,746,539 · App. 09/772,694

Scanning deposition head for depositing particles on a wafer

Inventors: James J. Sun, Benjamin Y. H. Liu
Patented Case View Patent ↗
Granted: Jun 8, 2004 Filed: Jan 30, 2001
Inventors
James J. Sun
Benjamin Y. H. Liu
Assignee (at issue)
MSP CORPORATION

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Quick Facts
Patent No.
US 6,746,539
App. No.
09/772,694
Filed
2001-01-30
Granted
2004-06-08
Kind
B2