Granted Patent
Utility
US 6,747,331 · App. 10/197,335
Method and packaging structure for optimizing warpage of flip chip organic packages
Inventors:
William Infantolino, Li Li, Steven G. Rosser, Sanjeev Sathe
Patented Case
View Patent ↗
Granted: Jun 8, 2004
Filed: Jul 17, 2002
Inventors
William Infantolino
Li Li
Steven G. Rosser
Sanjeev Sathe
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.