Granted Patent
Utility
US 6,747,341 · App. 10/183,287
Integrated circuit and laminated leadframe package
Inventors:
James H. Knapp, Stephen St. Germain
Patented Case
View Patent ↗
Granted: Jun 8, 2004
Filed: Jun 27, 2002
Inventors
James H. Knapp
Stephen St. Germain
Assignee (at issue)
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.