IP Library Granted Patent US 6,747,360
Granted Patent Utility
US 6,747,360 · App. 10/457,429

Conductive hardening resin for a semiconductor device and semiconductor device using the same

Inventors: Akira Fukuizumi, Kazuto Oonami
Patented Case View Patent ↗
Granted: Jun 8, 2004 Filed: Jun 10, 2003
Inventors
Akira Fukuizumi
Kazuto Oonami
Assignees (at issue)
NEC Electronics Corporation
SUMITOMO BAKELITE CO., LTD.

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Quick Facts
Patent No.
US 6,747,360
App. No.
10/457,429
Filed
2003-06-10
Granted
2004-06-08
Kind
B2