Granted Patent
Utility
US 6,749,997 · App. 10/146,421
Method for providing an arbitrary three-dimensional microstructure in silicon using an anisotropic deep etch
Inventors:
Alfredo M. Morales, Marcela Gonzales
Patented Case
View Patent ↗
Granted: Jun 15, 2004
Filed: May 14, 2002
Inventors
Alfredo M. Morales
Marcela Gonzales
Assignee (at issue)
Sandia National Laboratory
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.