Granted Patent
Utility
US 6,750,301 · App. 09/611,899
Die attach adhesives with epoxy compound or resin having allyl or vinyl groups
Inventors:
Mark Richard Bonneau, Yun Kil Shin, Gina Hoang, Martin Sobczak
Patented Case
View Patent ↗
Granted: Jun 15, 2004
Filed: Jul 7, 2000
Inventors
Mark Richard Bonneau
Yun Kil Shin
Gina Hoang
Martin Sobczak
Assignee (at issue)
National Starch and Chemical Investment Holding Copporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.