Granted Patent
Utility
US 6,750,545 · App. 10/376,988
Semiconductor package capable of die stacking
Inventors:
Sun Goo Lee, Sang Jae Jang, Choon Heung Lee, Akito Yoshida
Patented Case
View Patent ↗
Granted: Jun 15, 2004
Filed: Feb 28, 2003
Inventors
Sun Goo Lee
Sang Jae Jang
Choon Heung Lee
Akito Yoshida
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.