Granted Patent
Utility
US 6,750,549 · App. 10/335,202
Variable pad diameter on the land side for improving the co-planarity of ball grid array packages
Inventors:
Biju Chandran, Carlos Gonzalez
Patented Case
View Patent ↗
Granted: Jun 15, 2004
Filed: Dec 31, 2002
Inventors
Biju Chandran
Carlos Gonzalez
Assignee (at issue)
Intel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.