Granted Patent
Utility
US 6,750,552 · App. 10/323,963
Integrated circuit package with solder bumps
Inventor:
Kollengode S. Narayanan
Patented Case
View Patent ↗
Granted: Jun 15, 2004
Filed: Dec 18, 2002
Inventor
Kollengode S. Narayanan
Assignee (at issue)
NETLOGIC MICROSYSTEMS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.