Granted Patent
Utility
US 6,759,341 · App. 10/412,978
Wafering method comprising a plasma etch with a gas emitting wafer holder
Inventor:
Chih Yang Li
Patented Case
View Patent ↗
Granted: Jul 6, 2004
Filed: Apr 9, 2003
Inventor
Chih Yang Li
Assignee (at issue)
Tru-Si Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.